The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit Board) ...

Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

Featuring power ratings from 0.5W (0865 ball grid package) to 1.6W (1065 ball grid package), the CHC series of termination arrays are suited for use in portable products and high-speed switches that ...