The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

AMD (AMD) introduced the AMD Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Featuring power ratings from 0.5W (0865 ball grid package) to 1.6W (1065 ball grid package), the CHC series of termination arrays are suited for use in portable products and high-speed switches that ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...