Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Intel announced that its researchers foresee a way to make chips 10 times ...

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...

In the arena of business ethics, the phrase "do no harm" is central to the ideal of how businesses should conduct themselves. However, in a convoluted way, this same mantra has cast a ...

One day we might see on-package DRAM, even. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Add us as a preferred source on Google Intel's taken ...

A change in the way TSMC makes chips for Apple could mean a lot more variation in performance for the iPhone 18 models, by Apple switching combinations of CPU, GPU, and Neural Engine. One of the ...