Hitachi, Ltd. (NYSE: HIT / TSE: 6501) in cooperation with Elpida Memory, Inc. (TSE: 6665), have proposed a new DRAM(*1) circuit design enabling 0.4-V operation. The proposed array employs a twin cell ...
BANGALORE, India, Jan. 8, 2026 /PRNewswire/ -- The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, ...
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
The continued dominance of the AI market is driving the DRAM memory industry into chip shortages, as the AI and HBM markets eat up all production capacity. In a new report from MyDrivers, the ...
What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...
For several decades, the semiconductor industry has been looking for alternative memory technologies to fill the gap between dynamic random-access memory (DRAM), the compute system’s main memory, and ...
RAM prices have skyrocketed globally in 2025, with industry officials pointing to explosive demand from AI data centers as the primary cause. Mainstream DDR5 memory modules now cost at least twice ...
Why we need DDR5. Security improvements of DDR5 over DDR4. How RowHammer can be thwarted. Rapid growth in the world’s digital information has driven continued improvements in computing to process, ...
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