In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

SEOUL, Sept. 3 (Yonhap) -- Samsung Electro-Mechanics Co. and LG Innotek Co. on Wednesday showcased their latest package substrates for artificial intelligence, server and automotive sectors at a ...

The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...

Sumitomo Chemical Chairman Keiichi Iwata (left) and Samsung Electro-Mechanics President Duckhyun Chang sign an MOU. The joint venture MOU is part of a strategy to overcome the limitations of package ...