The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

In any solar cell process, the metallization step is critical as it often sets conditions and limitations for the other process steps. The main metallization technique used today in Si solar cell ...

Wolfspeed’s 300mm platform will unify high-volume silicon carbide manufacturing for power electronics with advanced ...

Graphene has long promised new sensors and electronics. The real challenge was not performance, but manufacturing. That bottleneck is breaking ...

The ability to create materials with well-defined characteristics at the micro-and sub-micrometer dimensions is critical in a broad range of research fields and enterprises, from microelectronic chips ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

MEMC Electronic Materials Inc. today announced it has begun volume production of what it claims is a defect-free silicon wafer. According to the company, many silicon wafers have reduced surface ...

A research group at Germany's Fraunhofer Institute for Solar Energy Systems (Fraunhofer ISE) has shown that in situ gettering during the application of asymmetric configuration of n-type and p-type ...