The physical characteristics of lead-free solder impose new defect types that test and inspection techniques must address. For example, lead-free solder's higher melting point and reduced wetting, ...

One day [Andy] was cruising around eBay and spotted something interesting. Forty Virtex-E FPGAs for two quid each. These are the big boys of the FPGA world, with 512 user IO pins, almost 200,000 logic ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

TL;DR: LG Innotek's new Copper Post technology replaces traditional solder balls with copper columns, enabling 20% denser chip packaging for thinner smartphones. This innovation improves heat ...

Can unleaded BGA solder balls potentially grow tin whiskers as tin plated leads do? Annealing seems to be the standard approach for pure tin plated lead devices, but what about BGAs? Are unleaded BGA ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

ANAHEIM, Calif. — Agilent Technologies Inc. continues to try and bring electronics manufacturing test into the third dimension. The Palo Alto, Calif.-based ATE company unveiled the SJ50 Series II, its ...

Intel’s dual-core processors have been described as “nothing short of amazing” by reverse engineering firm Chipworks, following analysis of the Presler processor core. Presler, at the core of Intel’s ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...