(Structural analyses top the list.) And although most thermal simulations are done with finite elements, there are advantages to methods that work with networks of thermal bodies connected by links ...

New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal ...

Multi-physics is the new buzzword in semiconductor design and analysis, but the fuzziness of the term is a reflection of just how many new and existing problems need to be addressed simultaneously in ...