Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...
The 350 mm diameter center opening in the RotoRing300 TM rotary table easily accommodates large 300 mm (12”) semiconductor wafers, allowing for eased extraction of the chip dies from the wafer during ...
Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...
San Jose-based Exsil Inc. said it has developed a high quality restoration process for gallium arsenide (GaAs) wafers. The process would allow GaAs fabs to reclaim and reuse wafers within their ...
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/zjghfx/silicon_wafers) has announced the addition of the "Silicon Wafers for ...
In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...
Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
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