Fig. 1. Trade-off between fidelity/accuracy and simulation time for different solutions providing thermo-chemical analysis of composite parts during processing. Photo Credit: Convergent Manufacturing ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
The product development process can be improved with single-physics simulation, multiphysics simulation and simulation apps. This article looks at three real-world examples that show how integrating ...
The “composites for sustainable mobility” (CosiMo) project was launched in 2018 by Faurecia Clean Mobility (Nanterre, France) to develop a smart thermoplastic composite resin transfer molding (RTM) ...
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